Fundamentals Of Microelectronics


Author: Behzad Razavi
Publisher: John Wiley & Sons
ISBN: N.A
Category:
Page: 960
View: 9474
DOWNLOAD NOW »


Fundamentals of Microelectronics, 2nd Edition


Author: Behzad Razavi
Publisher: Wiley Global Education
ISBN: 1118559576
Category: Technology & Engineering
Page: 903
View: 1925
DOWNLOAD NOW »
By helping students develop an intuitive understanding of the subject, Fundamentals of Microelectronics teaches them to think like engineers. The second edition of Razavi’s Fundamentals of Microelectronics retains its hallmark emphasis on analysis by inspection and building students’ design intuition, and it incorporates a host of new pedagogical features that make it easier to teach and learn from, including: application sidebars, self-check problems with answers, simulation problems with SPICE and MULTISIM, and an expanded problem set that is organized by degree of difficulty and more clearly associated with specific chapter sections.

Fundamentals of microelectronics processing


Author: Hong H. Lee
Publisher: McGraw-Hill College
ISBN: N.A
Category: Technology & Engineering
Page: 514
View: 4149
DOWNLOAD NOW »


Fundamentals of Microfabrication

The Science of Miniaturization, Second Edition
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 9780849308260
Category: Technology & Engineering
Page: 752
View: 4729
DOWNLOAD NOW »
MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world. A bestseller in its first edition, Fundamentals of Microfabrication, Second Edition reflects the many developments in methods, materials, and applications that have emerged recently. Renowned author Marc Madou has added exercise sets to each chapter, thus answering the need for a textbook in this field. Fundamentals of Microfabrication, Second Edition offers unique, in-depth coverage of the science of miniaturization, its methods, and materials. From the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering, it provides the background, tools, and directions you need to confidently choose fabrication methods and materials for a particular miniaturization problem. New in the Second Edition Revised chapters that reflect the many recent advances in the field Updated and enhanced discussions of topics including DNA arrays, microfluidics, micromolding techniques, and nanotechnology In-depth coverage of bio-MEMs, RF-MEMs, high-temperature, and optical MEMs. Many more links to the Web Problem sets in each chapter

Microelectronics

From Fundamentals to Applied Design
Author: Maurizio Di Paolo Emilio
Publisher: Springer
ISBN: 3319225456
Category: Technology & Engineering
Page: 100
View: 9368
DOWNLOAD NOW »
This book serves as a practical guide for practicing engineers who need to design analog circuits for microelectronics. Readers will develop a comprehensive understanding of the basic techniques of analog modern electronic circuit design, discrete and integrated, application as sensors and control and data acquisition systems,and techniques of PCB design. · Describes fundamentals of microelectronics design in an accessible manner; · Takes a problem-solving approach to the topic, offering a hands-on guide for practicing engineers; · Provides realistic examples to inspire a thorough understanding of system-level issues, before going into the detail of components and devices; · Uses a new approach and provides several skills that help engineers and designers retain key and advanced concepts.

Architekturen der digitalen Signalverarbeitung


Author: Peter Pirsch
Publisher: Springer-Verlag
ISBN: 3322967239
Category: Technology & Engineering
Page: 368
View: 8227
DOWNLOAD NOW »
Mit den Fortschritten in der Mikroelektronik wächst auch der Bedarf an VLSI-Realisierungen von digitalen Signalverarbeitungseinheiten. Die zunehmende Komplexität der Signalverarbeitungsverfahren führt insbesondere bei Signalen mit hoher Quellenrate auf Anforderungen, die nur durch spezielle Schaltungsstrukturen erfüllt werden können. Dieses Buch behandelt Schaltungstechniken und Architekturen zur Erzielung hoher Durchsatzraten von Algorithmen der Signalverarbeitung. Neben alternativen Schaltungstechniken zur Realisierung der Basisoperationen, Addition, Multiplikation und Division werden CORDIC-Architekturen zur Implementierung transzendenter Funktionen vorgestellt. Zur Konzeption von Systemen mit Parallelverarbeitung und Pipelining wird ein allgemeines Verfahren zur Abbildung von Signalverarbeitungsalgorithmen auf anwendungsspezifischen Architekturen erläutert. Hierzu werden beispielhaft spezielle Architekturen für Filter, Matrixoperationen und die diskrete Fouriertransformation erörtert. Architekturen programmierbarer digitaler Signalprozessoren sowie beispielhafte zugehörige Implementierungen sind eingeschlossen. Das Buch soll sowohl Studenten und Ingenieure der Elektrotechnik als auch der technischen Informatik mit Architekturkonzepten der digitalen Signalverarbeitung vertraut machen.

Design of Integrated Circuits for Optical Communications


Author: Behzad Razavi
Publisher: John Wiley & Sons
ISBN: 1118439457
Category: Technology & Engineering
Page: 442
View: 8547
DOWNLOAD NOW »
The only book on integrated circuits for optical communications that fully covers High-Speed IOs, PLLs, CDRs, and transceiver design including optical communication The increasing demand for high-speed transport of data has revitalized optical communications, leading to extensive work on high-speed device and circuit design. With the proliferation of the Internet and the rise in the speed of microprocessors and memories, the transport of data continues to be the bottleneck, motivating work on faster communication channels. Design of Integrated Circuits for Optical Communications, Second Edition deals with the design of high-speed integrated circuits for optical communication transceivers. Building upon a detailed understanding of optical devices, the book describes the analysis and design of critical building blocks, such as transimpedance and limiting amplifiers, laser drivers, phase-locked loops, oscillators, clock and data recovery circuits, and multiplexers. The Second Edition of this bestselling textbook has been fully updated with: A tutorial treatment of broadband circuits for both students and engineers New and unique information dealing with clock and data recovery circuits and multiplexers A chapter dedicated to burst-mode optical communications A detailed study of new circuit developments for optical transceivers An examination of recent implementations in CMOS technology This text is ideal for senior graduate students and engineers involved in high-speed circuit design for optical communications, as well as the more general field of wireline communications.

RF MEMS and Their Applications


Author: Vijay K. Varadan,K. J. Vinoy,K. A. Jose
Publisher: John Wiley & Sons
ISBN: 0470846194
Category: Technology & Engineering
Page: 406
View: 8466
DOWNLOAD NOW »
Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.

RF Microelectronics


Author: Behzad Razavi
Publisher: Pearson Professional
ISBN: 9780137134731
Category: Technology & Engineering
Page: 916
View: 4082
DOWNLOAD NOW »
The Acclaimed RF Microelectronics Best-Seller, Expanded and Updated for the Newest Architectures, Circuits, and Devices Wireless communication has become almost as ubiquitous as electricity, but RF design continues to challenge engineers and researchers. In the 15 years since the first edition of this classic text, the demand for higher performance has led to an explosive growth of RF design techniques. In RF Microelectronics, Second Edition, Behzad Razavi systematically teaches the fundamentals as well as the state-of-the-art developments in the analysis and design of RF circuits and transceivers. Razavi has written the second edition to reflect today's RF microelectronics, covering key topics in far greater detail. At nearly three times the length of the first edition, the second edition is an indispensable tome for both students and practicing engineers. With his lucid prose, Razavi now Offers a stronger tutorial focus along with hundreds of examples and problems Teaches design as well as analysis with the aid of step-by-step design procedures and a chapter dedicated to the design of a dual-band WiFi transceiver Describes new design paradigms and analysis techniques for circuits such as low-noise amplifiers, mixers, oscillators, and frequency dividers This edition's extensive coverage includes brand new chapters on mixers, passive devices, integer-N synthesizers, and fractional-N synthesizers. Razavi's teachings culminate in a new chapter that begins with WiFi's radio specifications and, step by step, designs the transceiver at the transistor level. Coverage includes Core RF principles, including noise and nonlinearity, with ties to analog design, microwave theory, and communication systems An intuitive treatment of modulation theory and wireless standards from the standpoint of the RF IC designer Transceiver architectures such as heterodyne, sliding-IF, directconversion, image-reject, and low-IF topologies. Low-noise amplifiers, including cascode common-gate and commonsource topologies, noise-cancelling schemes, and reactance-cancelling configurations Passive and active mixers, including their gain and noise analysis and new mixer topologies Voltage-controlled oscillators, phase noise mechanisms, and various VCO topologies dealing with noisepower-tuning trade-offs All-new coverage of passive devices, such as integrated inductors, MOS varactors, and transformers A chapter on the analysis and design of phase-locked loops with emphasis on low phase noise and low spur levels Two chapters on integer-N and fractional-N synthesizers, including the design of frequency dividers Power amplifier principles and circuit topologies along with transmitter architectures, such as polar modulation and outphasing

3D Microelectronic Packaging

From Fundamentals to Applications
Author: Yan Li,Deepak Goyal
Publisher: Springer
ISBN: 3319445863
Category: Technology & Engineering
Page: 463
View: 6453
DOWNLOAD NOW »
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Fundamentals of Microsystems Packaging


Author: Tummala
Publisher: McGraw Hill Professional
ISBN: 9780071371698
Category: Technology & Engineering
Page: 967
View: 9253
DOWNLOAD NOW »
"LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. Youll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologieswafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing"

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications


Author: Yosi Shacham-Diamand,Tetsuya Osaka,Madhav Datta,Takayuki Ohba
Publisher: Springer Science & Business Media
ISBN: 9780387958682
Category: Science
Page: 552
View: 2317
DOWNLOAD NOW »
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Polymers in microelectronics

fundamentals and applications
Author: David S. Soane,Zoya Martynenko
Publisher: Elsevier Science Limited
ISBN: 9780444872906
Category: Technology & Engineering
Page: 308
View: 6535
DOWNLOAD NOW »


Integrating Microelectronics into Gas Distribution


Author: W.F. Rush,J.E. Huebler,R.W. Smith
Publisher: CRC Press
ISBN: 1482286386
Category: Architecture
Page: 499
View: 7764
DOWNLOAD NOW »


Mikrofluidik

Entwurf, Herstellung und Charakterisierung
Author: Nam-Trung Nguyen
Publisher: Springer-Verlag
ISBN: 3322800695
Category: Science
Page: 256
View: 8214
DOWNLOAD NOW »
Die Mikrofluidik ist ein Teilgebiet der Mikrosystemtechnik. Obwohl sich dieses Forschungsfeld noch in der frühen Entwicklungsphase befindet, verspricht Mikrofluidik große wissenschaftliche und kommerzielle Potenziale in der nahen Zukunft. Dieses Buch ist das erste deutschsprachige Fachbuch für Universitätsstudenten und Ingenieure auf dem Gebiet der Mikrofluidik und Mikrosystemtechnik. Es ermöglicht eine didaktisch sorgfältig gegliederte Einführung in die Mikrofluidik. Viele ausgearbeitete Rechenbeispiele und Fallbeispiele illustrieren den behandelten Inhalt, ermöglichen ein leichtes Verständnis der einzelnen Probleme und umfassen die wichtigsten Aspekte in der Entwicklung der mikrofluidischen Komponenten, der theoretischen Grundlagen, des Entwurfprozesses sowie deren Herstellung und Charakterisierung.

Fundamentals of Nanotechnology


Author: Gabor L. Hornyak,John J. Moore,H.F. Tibbals,Joydeep Dutta
Publisher: CRC Press
ISBN: 142004804X
Category: Technology & Engineering
Page: 786
View: 4482
DOWNLOAD NOW »
WINNER 2009 CHOICE AWARD OUTSTANDING ACADEMIC TITLE! Nanotechnology is no longer a subdiscipline of chemistry, engineering, or any other field. It represents the convergence of many fields, and therefore demands a new paradigm for teaching. This textbook is for the next generation of nanotechnologists. It surveys the field’s broad landscape, exploring the physical basics such as nanorheology, nanofluidics, and nanomechanics as well as industrial concerns such as manufacturing, reliability, and safety. The authors then explore the vast range of nanomaterials and systematically outline devices and applications in various industrial sectors. This color text is an ideal companion to Introduction to Nanoscience by the same group of esteemed authors. Both titles are also available as the single volume Introduction to Nanoscience and Nanotechnology Qualifying instructors who purchase either of these volumes (or the combined set) are given online access to a wealth of instructional materials. These include detailed lecture notes, review summaries, slides, exercises, and more. The authors provide enough material for both one- and two-semester courses.

Thick film technology

fundamentals and applications in microelectronics
Author: Jeremy Agnew
Publisher: Hayden
ISBN: N.A
Category: Technology & Engineering
Page: 166
View: 1946
DOWNLOAD NOW »