Reliability of MEMS

This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices.

Author: Osamu Tabata

Publisher: John Wiley & Sons

ISBN: 9783527335015

Category: Technology & Engineering

Page: 324

View: 478

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This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
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MEMS Reliability

This series, authored by leading MEMS practitioners, strives to provide a framework where basic principles, known methodologies, and new applications are integrated in a coherent and consistent manner.

Author: Allyson L. Hartzell

Publisher: Springer Science & Business Media

ISBN: 144196018X

Category: Technology & Engineering

Page: 291

View: 812

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The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
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300 Tonnen 300 tons Santiago Sierra

This requires the elicitation of a methodology focused on MEMS reliability, which the authors discuss. A new testing and analysis infrastructure must also be developed to meet the needs of this methodology.

Author: Birgit Albers

Publisher:

ISBN: OCLC:314814962

Category:

Page: 15

View: 235

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MEMS Reliability

This series, authored by leading MEMS practitioners, strives to provide a framework where basic principles, known methodologies, and new applications are integrated in a coherent and consistent manner.

Author: Allyson L. Hartzell

Publisher: Springer

ISBN: 1441960171

Category: Technology & Engineering

Page: 291

View: 941

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The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.
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MEMS Reliability for Critical and Space Applications

A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.

Author: Russell A. Lawton

Publisher: Society of Photo Optical

ISBN: UOM:39015043411860

Category: Technology & Engineering

Page: 176

View: 952

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A selection of scientific papers on the reliability of microelectromechanical systems (MEMS) for critical and space applications.
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Reliability Packaging Testing and Characterization of MEMS MOEMS IV

These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Author: Danelle Mary Tanner

Publisher: Society of Photo Optical

ISBN: 081945690X

Category: Computers

Page: 220

View: 197

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Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
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MEMS Reliability Infrastructure Test Structures Experiments and Failure Modes

The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.

Author:

Publisher:

ISBN: OCLC:68437747

Category:

Page:

View: 606

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The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.
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Reliability Modeling of Microelectromechanical Systems Using Neural Networks

Now, the reliability of a new proposed MEMS device can be estimated by using the appropriate trained neural networks developed in this work.Perera.

Author: National Aeronautics and Space Administration (NASA)

Publisher: Createspace Independent Publishing Platform

ISBN: 1720707197

Category:

Page: 78

View: 870

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Microelectromechanical systems (MEMS) are a broad and rapidly expanding field that is currently receiving a great deal of attention because of the potential to significantly improve the ability to sense, analyze, and control a variety of processes, such as heating and ventilation systems, automobiles, medicine, aeronautical flight, military surveillance, weather forecasting, and space exploration. MEMS are very small and are a blend of electrical and mechanical components, with electrical and mechanical systems on one chip. This research establishes reliability estimation and prediction for MEMS devices at the conceptual design phase using neural networks. At the conceptual design phase, before devices are built and tested, traditional methods of quantifying reliability are inadequate because the device is not in existence and cannot be tested to establish the reliability distributions. A novel approach using neural networks is created to predict the overall reliability of a MEMS device based on its components and each component's attributes. The methodology begins with collecting attribute data (fabrication process, physical specifications, operating environment, property characteristics, packaging, etc.) and reliability data for many types of microengines. The data are partitioned into training data (the majority) and validation data (the remainder). A neural network is applied to the training data (both attribute and reliability); the attributes become the system inputs and reliability data (cycles to failure), the system output. After the neural network is trained with sufficient data. the validation data are used to verify the neural networks provided accurate reliability estimates. Now, the reliability of a new proposed MEMS device can be estimated by using the appropriate trained neural networks developed in this work.Perera. J. SebastianJohnson Space CenterMICROELECTROMECHANICAL SYSTEMS; RELIABILITY ANALYSIS; MICROELECTRONICS; EVALUATION; DATA ACQUISITION; N
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MEMS Reliability

These already exist for the microelectronics portion of such integrated systems. The challenge lies in the less well understood micromachine portions and its synergistic effects with microelectronics.

Author:

Publisher:

ISBN: OCLC:68434521

Category:

Page: 9

View: 355

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MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost effective solutions only if they prove to be sufficiently reliable. A valid reliability assessment of MEMS has three prerequisites: (1) statistical significance; (2) a technique for accelerating fundamental failure mechanisms, and (3) valid physical models to allow prediction of failures during actual use. These already exist for the microelectronics portion of such integrated systems. The challenge lies in the less well understood micromachine portions and its synergistic effects with microelectronics. This paper presents a methodology addressing these prerequisites and a description of the underlying physics of reliability for micromachines.
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Mems Reliability Assurance Guidelines for Space Applications

This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability.

Author: National Aeronautics and Space Administration (NASA)

Publisher: Createspace Independent Publishing Platform

ISBN: 172197704X

Category:

Page: 312

View: 726

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This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment. Stark, Brian (Editor) Jet Propulsion Laboratory NAS7-1407...
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Design for Reliability Applied to RF MEMS Devices and Circuits Issued from Different TRL Environments

This novel approach allows the end-user to infer the evolution of the device performance versus time going one step further in the Design for Reliability in RF-MEMS.

Author: Nuria Torres Matabosch

Publisher:

ISBN: OCLC:868227562

Category:

Page: 119

View: 611

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This thesis is intended to deal with reliability of RF-MEMS devices (switches, in particular) from a designer point of view using different fabrication process approaches. This means that the focus will be on how to eliminate or alleviate at the design stage the effects of the most relevant failure mechanisms in each case rather than studying the underlying physics of failure. The detection of the different failure mechanisms are investigated using the RF performance of the device and the developed equivalent circuits. This novel approach allows the end-user to infer the evolution of the device performance versus time going one step further in the Design for Reliability in RF-MEMS. The division of the fabrication process has been done using the Technology Readiness Level of the process. It assesses the maturity of the technology prior to incorporating it into a system or subsystem. An analysis of the different R&D approaches will be presented by highlighting the differences between the different levels in the TRL classification. This thesis pretend to show how reliability can be improved regarding the approach of the fabrication process starting from a very flexible one (LAAS-CNRS as example of low-TRL) passing through a component approach (CEA-Leti as example of medium-TRL) and finishing with a standard co-integrated CMOS-MEMS process (IHP example of high TRL).
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Reliability and Maintenance

This book on systems reliability, which equally includes maintenance-related policies, presents fundamental reliability concepts that are applied in a number of industrial cases.

Author: Leo Kounis

Publisher: BoD – Books on Demand

ISBN: 9781789239515

Category: Technology & Engineering

Page: 204

View: 625

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Amid a plethora of challenges, technological advances in science and engineering are inadvertently affecting an increased spectrum of today’s modern life. Yet for all supplied products and services provided, robustness of processes, methods, and techniques is regarded as a major player in promoting safety. This book on systems reliability, which equally includes maintenance-related policies, presents fundamental reliability concepts that are applied in a number of industrial cases. Furthermore, to alleviate potential cost and time-specific bottlenecks, software engineering and systems engineering incorporate approximation models, also referred to as meta-processes, or surrogate models to reproduce a predefined set of problems aimed at enhancing safety, while minimizing detrimental outcomes to society and the environment.
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Design Packaging and Reliability of MEMS S A Components and Systems

Technology refinements to the packaging process, as well as assuring the highest possible yield of serviceable F/S & A systems, are specifically addressed.

Author:

Publisher:

ISBN: OCLC:227915417

Category:

Page: 133

View: 926

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Technology refinements to the packaging process, as well as assuring the highest possible yield of serviceable F/S & A systems, are specifically addressed. The primary objective of this research project is to provide a basic physics based understanding of the behavior and performance of Safe and Arm (S & A) systems. The research covers a broad range of activities ranging from basic materials characterization to overall system level models. The research is conducted as a collaborative effort between Binghamton University, (BU), the Bennington Micro technology Center (BMC), and the Indian Head Division of the Naval Surface Warfare (IHDIV). BU focused on applied research related to the materials properties, the mechanical and thermal behavior of the system and the overall system performance and reliability under field conditions. BMC focused on process and manufacturing issues and help with the implementation of design changes and the exploration of additional applications.
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